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IPC4AI by ICC

IPC4AI-GPU-MDSF-R4765 AI Edge PC

IPC4AI-GPU-MDSF-R4765 is an active-cooled MDSF AI Box equipped with an NVIDIA® RTX™ 4070 8 GB GDDR6 MXM GPU module.

It delivers 4,608 CUDA cores and 65 W TGP with 560 TOPS (INT8, including sparsity) AI processing power; suitable for image processing, object recognition, and running AI models at the edge.

It is installed in RVS series computers: RVS-T1F, RVS-X1F, RVS-T1F-2C, RVS-X1F-2C, RVS-T2F, RVS-T3F. Only compatible with chassis that have processor fans (F).

With the chassis, its dimensions are 145 x 125 x 90 mm and weight is 1.75 kg; operates within -40°C to 70°C depending on CPU and GPU power.

The price includes the MXM GPU module; computer (chassis), RAM, and SSD are selected separately and quoted together.

Other power options in the same box: IPC4AI-GPU-MDSF-R4735.

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Technical Specifications TECHNICAL SPECIFICATIONS

Performance

AI Accelerator | GPU
AI Accelerator

NVIDIA® RTX™ 4070 (MXM Type A module)

GPU Architecture

Ada Lovelace

GPU Memory

8 GB GDDR6, 128 bit

AI Performance (TOPS)

560 (INT8, seyreklik Included)

Memory Bandwidth

256 GB/s

Physical

Power Consumption

65W TGP

Cooling

With Fan

Compatible Chassis

RVS-T1F, RVS-X1F, RVS-T1F-2C, RVS-X1F-2C, RVS-T2F, RVS-T3F

Total Dimensions with Chassis (mm)

145 x 125 x 90

Operating Temperature

-40°C ~ 70°C

System

CUDA Cores

4608

Tensor Cores

144

RT Cores

36

Interface

MXM 3.1 Type A (82 x 70 mm)

PCIe Signal

PCIe 4.0 x4/x8

AI Box Type

MDSF (active cooling, up to 65 W)

Product at a Glance

Product Summary

IPC4AI-GPU-MDSF-R4765 — AI Edge PC.

It operates in the -40°C ~ 70°C range.

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